Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1993-02-01
1994-02-22
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156345, 20419233, 20429832, G01N 2100
Patent
active
052883671
ABSTRACT:
A wavelength of light is monitored for end-point detection during etching. Spectral data is collected during etching which characterizes variation of light emitted by discharge produced during etching. At least one principal component of the data is calculated. Each principal component has variables, each variable has a weight, and each variable corresponds to a wavelength of the light emitted by the discharge. By examining or analyzing the weights, it is then determined which variable of the principal component varies during etching such that end-point of the etch can be detected by monitoring the wavelength corresponding to the variable.
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Angell David
Radens Carl J.
Dang Thi
International Business Machines - Corporation
Lau Richard
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