Internally reinforced bond pads

Details Internally reinforced bond pads Internally reinforced bond pads

2005-03-08

2005-03-08

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S734000, C257S738000, C257S741000

Reexamination Certificate

active

06864578

ABSTRACT:
Disclosed is a reinforced bond pad structure having nonplanar dielectric structures and a metallic bond layer conformally formed over the nonplanar dielectric structures. The nonplanar dielectric structures are substantially reproduced in the metallic bond layer so as to form nonplanar metallic structures. Surrounding each of the nonplanar metallic structures is a ring of dielectric material which provides a hard stop during probing of the bond pad so as to limit the amount of bond pad that can be removed during probing.

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patent: 20020068385 (2002-06-01), Ssu-Pin Ma et al.
patent: 20040004284 (2004-01-01), Lee et al.

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