4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

David A. Laudick

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Method of overmolding an electronic assembly having an...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Overmolded electronic assembly with insert molded heat sinks

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Technique for connector to printed circuit board decoupling...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate

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Technique for manufacturing an overmolded electronic assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Wafer applied thermally conductive interposer

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2839242

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