Overmolded electronic assembly with insert molded heat sinks

Details Overmolded electronic assembly with insert molded heat sinks Overmolded electronic assembly with insert molded heat sinks

2007-06-12

2007-06-12

Thompsopn, Gregb (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C029S841000, C029S827000, C029S832000, C257S788000, C257S796000, C361S707000, C361S708000

Reexamination Certificate

active

11045211

ABSTRACT:
An overmolded electronic assembly includes a substrate, a plurality of surface mount technology (SMT) integrated circuit (IC) chips, a plurality of heat sinks, a backplate and an overmold material. The substrate includes a plurality of conductive traces formed on a first surface of the substrate. The IC chips each include an active front side and a backside and the IC chips are electrically coupled to one or more of the traces. The heat sinks are each in thermal contact with the backside of a different one of the IC chips and are independent of each other. The backplate is attached to a second surface of the substrate, which is opposite the first surface of the substrate. The overmold material covers the first surface of the substrate and maintains the heat sinks in thermal contact with an associated one of the IC chips.

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