Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – Distinct contact secured to panel circuit
Reexamination Certificate
2005-06-14
2005-06-14
Zarroli, Michael C. (Department: 2839)
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
Distinct contact secured to panel circuit
Reexamination Certificate
active
06905349
ABSTRACT:
An electronic assembly and/or a mold is constructed to reduce deflection and resultant damage to components and/or an associated printed circuit board of the electronic assembly when the electronic assembly is overmolded.
REFERENCES:
patent: 5699235 (1997-12-01), Tsurumiya et al.
patent: 6572412 (2003-06-01), Beuther et al.
patent: 6733306 (2004-05-01), Kane et al.
patent: 6807731 (2004-10-01), Brandenburg et al.
patent: 6821135 (2004-11-01), Martin
Brandenburg Scott D.
Degenkolb Thomas A.
Laudick David A.
Mandel Larry M
Parker Richard D.
Chmielewski Stefan V.
Delphi Technologies Inc.
Zarroli Michael C.
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