Bumpless die and heat spreader lid module bonded to bumped...

Details Bumpless die and heat spreader lid module bonded to bumped... Bumpless die and heat spreader lid module bonded to bumped...

2006-05-02

2006-05-02

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S778000, C257S704000

Reexamination Certificate

active

07038316

ABSTRACT:
An IC package is assembled from a bumpless die, a die carrier having a plurality of solder bumps thereon, and a heat spreader lid. The bumpless die is bonded to the heat spreader lid to form a module and then the module is bonded to the bumped die carrier.

REFERENCES:
patent: 6317326 (2001-11-01), Vogel et al.
patent: 6455943 (2002-09-01), Sheu et al.
patent: 2004/0036170 (2004-02-01), Lee et al.
patent: 2004/0042178 (2004-03-01), Gektin et al.
patent: 2004/0159957 (2004-08-01), Lee
patent: 2004/0188817 (2004-09-01), Hua et al.

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