Apparatus and method for attaching a semiconductor die to a...

Details Apparatus and method for attaching a semiconductor die to a... Apparatus and method for attaching a semiconductor die to a...

2004-09-22

2008-08-05

Kerns, Kevin P (Department: 1793)

Metal fusion bonding

Process

With pretreating other than heating or cooling of work part...

C228S212000, C228S049500

Reexamination Certificate

active

07407085

ABSTRACT:
Embodiments of an apparatus and method for attaching a semiconductor die to a heat spreader (or other thermal component) are disclosed. The apparatus includes a substantially flat surface to receive a number of die, and the die may be held in place on the surface by a flux, the flux being subsequently removed prior to bonding. The apparatus may further include a number of registration elements to hold a heat spreader in a relative position over each die. Other embodiments are described and claimed.

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