4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Daniel Roman Gamota

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Assembly having a frame embedded in a polymeric encapsulant and

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Device for reworkable direct chip attachment

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture
Patent

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Frame embedded in a polymeric encapsulant

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Method and assembly for providing improved underchip encapsulati

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Method and assembly for providing improved underchip encapsulati

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent

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Profile ID: LFUS-PAI-P-523080

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