Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1997-11-21
2000-03-07
Kincaid, Kristine
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
174 524, H05K 116
Patent
active
060343338
ABSTRACT:
A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34), not in direct contact with the board (14), and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).
REFERENCES:
patent: 3706840 (1972-12-01), Moyle et al.
patent: 4814943 (1989-03-01), Okuaki
patent: 5120678 (1992-06-01), Moore et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5250848 (1993-10-01), Christie et al.
patent: 5461256 (1995-10-01), Yamada et al.
Gamota Daniel Roman
Skipor Andrew F.
Wyatt Karl W.
Yeh Chao-Pin
Zhou Wen Xu
Cuneo Kamand
Fekete Douglas D.
Kincaid Kristine
Motorola Inc.
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