Assembly having a frame embedded in a polymeric encapsulant and

Details Assembly having a frame embedded in a polymeric encapsulant and Assembly having a frame embedded in a polymeric encapsulant and

1995-12-29

1998-02-24

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

H05K 334

Patent

active

057201005

ABSTRACT:
A microelectronic assembly (10) includes an integrated circuit die (12) that is mounted to a printed circuit board (14). The integrated circuit die (12) overlies the printed circuit board (14) and includes an active face (26) that faces the printed circuit board (14) and is spaced apart therefrom by a gap (30). A plurality of solder bump interconnections (32) extend across the gap (30) and connect a plurality of board bond pads (22) with a plurality of die bond pads (28). A polymeric precursor (13) is dispensed onto the printed circuit board (14) about the integrated circuit die (12) and is curable to form a polymeric encapsulant (16). The polymeric precursor (13) is drawn into the gap (30) and forms a fillet (34) overlying the printed circuit board (14). A frame (18) is embedded in the fillet (34) and the polymeric precursor (13) is heated to cure the polymeric precursor (13) to form a polymeric encapsulant (16). The frame (18) is affixed to the printed circuit board (14) within the polymeric encapsulant (16) to provide increased mechanical strength for the microelectronic assembly (10).

REFERENCES:
patent: 4864470 (1989-09-01), Nishio
patent: 5120678 (1992-06-01), Moore et al.
patent: 5218234 (1993-06-01), Thompson et al.
patent: 5568684 (1996-10-01), Wong

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