Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Patent
1995-11-27
1998-09-08
Saadat, Mahshid D.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Ball or nail head type contact, lead, or bond
257787, H01L 2348, H01L 2352, H01L 2940
Patent
active
058048812
ABSTRACT:
A microelectronic assembly (10) includes a printed circuit board (12) that includes a substrate (14) having a die attach region (22) and a plurality of first bond pads (24) disposed and spaced apart at the die attach region (22). A channel (26) effective in improving fluid flow extends across the die attach region (22) apart from the first bond pads (24). An integrated circuit die (16) is mounted onto the printed circuit board (12) and includes a major face (28) facing the substrate (14) and spaced apart therefrom by a gap (30) and second bond pads (25) disposed on the major face (28) in a pattern such that each of the second bond pads (25) registers with a first bond pad (24). Solder bump interconnections (18) connect the first bond pads (24) to the second bond pads (25). Encapsulant (20) is disposed within the gap (30) and flows over the substrate (14) and the channel (26) to encapsulate the solder bump interconnections (18). Channel 26 enhances the flow of the precursor (19) in the gap (30) prior to curing the precursor (19) to form the encapsulant (20).
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Gamota Daniel Roman
Wille Steven Lewis
Clark S. V.
Fekete Douglas D.
MacIntyre John B.
Motorola Inc.
Saadat Mahshid D.
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