Device for reworkable direct chip attachment

Stock material or miscellaneous articles – Structurally defined web or sheet – Including aperture

Patent

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Details

361768, 361770, 361771, 228 563, 22818022, 228189, 228216, 228246, 428901, 174255, B32B 310

Patent

active

061564087

ABSTRACT:
The method (400, 500) and device (200) for reworkable direct chip attachment include a thermal-mechanical and mechanical stable solder joint for arranging connection pads on a top surface of the circuit board to facilitate connection for electronic elements, and affixing a reinforcement having apertures to accommodate solder joints to the top surface of the circuit board to facilitate solder attachment of the connection pads to the electronic elements wherein the reinforcement constrains deformation of the circuit board to provide reliable solder joints and facilitates attachment and removal of electronic elements from the circuit board.

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