4. Electrical connectors
  5. Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
  6. With provision to conduct electricity from panel circuit to...

Dan Willis

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Differential I/O spline for inexpensive breakout and...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Differential I/O spline for inexpensive breakout and...

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Electrical interface for memory connector

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Electronic packaging using conductive interposer connector

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Electronic packaging using conductive interproser connector

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2399087

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