Electronic packaging using conductive interposer connector

Details Electronic packaging using conductive interposer connector Electronic packaging using conductive interposer connector

2007-07-10

2007-07-10

Parekh, Nitin (Department: 2811)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S106000, C438S117000, C438S123000, C438S508000, C257S737000

Reexamination Certificate

active

10835675

ABSTRACT:
Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

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