Use of direct gold surface finish on a copper wire-bond...

Details Use of direct gold surface finish on a copper wire-bond... Use of direct gold surface finish on a copper wire-bond...

2005-12-06

2005-12-06

Lam, Cathy F. (Department: 1775)

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

C174S257000, C174S261000, C257S784000, C257S786000

Reexamination Certificate

active

06972152

ABSTRACT:
A wire-bonding substrate is described. The wire-bonding substrate includes a copper metallization and a gold surface finish disposed above and on the copper metallization. The gold surface finish completes a structure that includes at least one of a bond finger for wire bonding of a first side of the substrate, and a land pad for a ball attach on a second side of the substrate. A process of forming the surface finish is also disclosed. An electronic package is also disclosed that uses the surface finish on the wire-bonding substrate. A method of assembling an electronic package is also disclosed that includes the surface finish on the wire-bonding substrate. A computing system is also described that includes the surface finish on the wire-bonding substrate.

REFERENCES:
patent: 5097100 (1992-03-01), Jackson
patent: 6063481 (2000-05-01), Arrington et al.
patent: 6162365 (2000-12-01), Bhatt et al.
patent: 6359233 (2002-03-01), Joy et al.
patent: 6383401 (2002-05-01), Labzentis et al.

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