Slotted thermal dissipater for a semiconductor package

Details Slotted thermal dissipater for a semiconductor package Slotted thermal dissipater for a semiconductor package

1995-06-01

1996-02-06

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

With heat sink embedded in encapsulant

257713, 257718, 257675, 361707, 361723, H01L 2334, H01L 23495, H05K 720

Patent

active

054898056

ABSTRACT:
An integrated circuit package that contains a heat spreader which has a plurality of legs stamped from a sheet of metal material. The heat spreader also has a plurality of slots which allow plastic to flow between the bonding wires of the integrated circuit assembly during the molded injection process of the package.

REFERENCES:
patent: 5225710 (1993-07-01), Westerkamp

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