4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Craig Mitchell

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active

Compliant integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Compliant integrated circuit package and method of fabricating t

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Compliant interface for semiconductor chip and method therefor

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Patent

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Encapsulant for microelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Method for making a semiconductor chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-513762

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