Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Of specified material other than unalloyed aluminum
Inventor
active
Batch assembly of high density hermetic packages for power semic
Bonds between metal and a non-metallic substrate
Direct bonded symmetric-metallic-laminate/substrate structures
Direct bonding of copper to aluminum nitride substrates
Direct thermocompression bonding for thin electronic power chips
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Profile ID: LFUS-PAI-P-28180