Direct bonded symmetric-metallic-laminate/substrate structures

Details Direct bonded symmetric-metallic-laminate/substrate structures Direct bonded symmetric-metallic-laminate/substrate structures

1991-10-15

1992-03-31

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428621, 428632, 428629, 428663, 428665, 428674, 228121, 228124, B32B 1504, C04B 3702, B23K 3522

Patent

active

051007401

ABSTRACT:
A composite structure comprising a symmetric bimetallic laminate bonded to a separate substrate is provided by eutectic bonding the bimetallic laminate to the substrate. A variety of beneficial structures can be provided.

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Patent Office of Japan, File Supplier Japs & JP-A-20 36 553 (Sumitomo Electric Ind. Ltd) 06-02-1990 Abstract.

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