Bonds between metal and a non-metallic substrate

Details Bonds between metal and a non-metallic substrate Bonds between metal and a non-metallic substrate

1975-02-12

1976-11-23

Shore, Ronald J.

Joints and connections

Molded joint

Fusion bond, e.g., weld, etc.

403404, 52759, 174 685, 228903, C04B 3702

Patent

active

039934110

ABSTRACT:
A direct bond between metallic members and non-metallic members is achieved at elevated temperatures in a controlled reactive atmosphere without resorting to the use of electroless plating, vacuum deposition or intermediate metals. A metal member such as copper, for example, is placed in contact with a non-metallic substrate, such as alumina, the metal member and the substrate are heated to a temperature slightly below the melting of the metal, e.g., between approximately 1065.degree. and 1080.degree. C. for copper, with the heating being performed in a reactive atmosphere, such as an oxidizing atmosphere, for a sufficient time to create a copper-copper oxide eutectic melt which, upon cooling, bonds the copper to the substrate. Various metals, non-metals and reactive gases are described for direct bonding.

REFERENCES:
patent: 1906691 (1933-05-01), Lilienfeld
patent: 3010188 (1961-11-01), Bol et al.
patent: 3128545 (1964-04-01), Cooper
patent: 3220938 (1965-11-01), McLean et al.
patent: 3333324 (1967-08-01), Roswell et al.
patent: 3517432 (1970-06-01), Sandstrom
patent: 3676292 (1972-07-01), Pryor et al.

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