4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Connie M. Wong

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Conductive interconnect structures and methods for forming...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Multilayer interconnection and method

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Wire interconnect structures for connecting an integrated circui

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Wire interconnect structures for connecting an integrated circui

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Profile ID: LFUS-PAI-P-149879

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