Wire interconnect structures for connecting an integrated circui

Details Wire interconnect structures for connecting an integrated circui Wire interconnect structures for connecting an integrated circui

1992-11-17

1994-08-02

Picard, Leo P.

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174257, 174260, 361760, 361784, H05K 0100

Patent

active

053348044

ABSTRACT:
An interconnect structure for connecting an integrated circuit (IC) chip to a supporting substrate is described. The supporting substrate serves to communicate signals between the IC chip and the "outside world," such as other IC chips. In one embodiment, the interconnect structure comprises an interconnect substrate having a first post disposed on one of its surfaces and a second post disposed on another of its surfaces. One post is for contacting the IC chip and the other is for contacting the major substrate. Each post comprises an elongated body having top and bottom ends, with the bottom end being mounted to one of the substrate surfaces and the top end having a substantially flat surface which is substantially co-planer with the substrate surface. The interconnect substrate further comprises a device for de-concentrating the mechanical stain present at one or both of the top and bottom ends of each post. The first and second posts are electrically coupled to one anther so that an electrical signal may pass from IC chip to the supporting substrate, and vice-versa.

REFERENCES:
patent: 3726002 (1973-04-01), Greenstein et al.
patent: 3871015 (1975-03-01), Lin et al.
patent: 3980917 (1976-09-01), Kakizaki et al.
patent: 4067104 (1978-01-01), Tracy
patent: 4418857 (1983-12-01), Ainslie et al.
patent: 4545610 (1985-10-01), Lakritz et al.
patent: 4547834 (1985-10-01), Dumont et al.
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4646050 (1987-02-01), Kling et al.
patent: 4664309 (1987-05-01), Allen et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4783722 (1988-11-01), Osaki et al.
patent: 4835344 (1989-05-01), Iyogi et al.
patent: 4954878 (1990-09-01), Fox et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5046954 (1991-09-01), Schmedding
patent: 5054192 (1991-10-01), Cray et al.
patent: 5074947 (1991-12-01), Estes et al.

Affiliated with

Also associated with

Rating

Wire interconnect structures for connecting an integrated circui does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Wire interconnect structures for connecting an integrated circui, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Wire interconnect structures for connecting an integrated circui will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-66385