4. Chemistry of inorganic compounds
  5. Treating mixture to obtain metal containing compound
  6. Group ib metal

Compeq Manufacturing Co., Ltd.

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Method for forming heightened solder bumps on circuit boards

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for producing copper sulfate from waste copper-containing

Chemistry of inorganic compounds – Treating mixture to obtain metal containing compound – Group ib metal
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Method of bonding copper and resin

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Method of bonding copper and resin

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
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Method of making rigid-flexible printed circuit board having...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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