Method of bonding copper and resin

Details Method of bonding copper and resin Method of bonding copper and resin

1990-05-07

1991-04-09

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 156637, 156664, 156902, 252 791, 252 795, B44C 122, C23F 100, C03C 1500, C03C 2506

Patent

active

050062000

ABSTRACT:
A method of bonding copper and resin comprising the steps of:

REFERENCES:
patent: 2291592 (1942-07-01), Dowling
patent: 4642161 (1987-02-01), Akahoshi et al.
patent: 4702793 (1987-10-01), Garlough et al.
patent: 4775444 (1988-10-01), Cordani
patent: 4902551 (1990-02-01), Nakaso et al.

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