Method for forming heightened solder bumps on circuit boards

Details Method for forming heightened solder bumps on circuit boards Method for forming heightened solder bumps on circuit boards

2005-12-27

2005-12-27

Nelms, David (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257S738000

Reexamination Certificate

active

06979636

ABSTRACT:
The present invention relates a method for forming heightened solder bumps on a circuit board, which has a surface formed with a plurality of pads and a solder resist thereon and the pads are exposed from the solder resist. The steps of the method mainly are: firstly, applying a first stencil printing and a first reflow process to the circuit board so that a plurality of first solder bumps form on the pads respectively. Then, apply a second stencil printing and a second reflow process to the circuit board so as to have solder paste formed on the first solder bumps and to have the solder paste integrated with the first solder bumps respectively to form the heightened solder bumps on the pads.

REFERENCES:
patent: 6468893 (2002-10-01), Ueoka

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