Method of bonding copper and resin

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

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Details

148269, 148272, 156319, 174259, 25218229, 427343, 4274195, 428623, 428626, 428629, B32B 3100

Patent

active

051474921

ABSTRACT:
A method of bonding copper and resin comprising the steps of:

REFERENCES:
patent: 4642161 (1987-02-01), Akahoshi et al.
patent: 4902551 (1990-02-01), Nakaso et al.

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