Method of making rigid-flexible printed circuit board having...

Details Method of making rigid-flexible printed circuit board having... Method of making rigid-flexible printed circuit board having...

2008-06-30

2011-10-11

Banks, Derris (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S830000, C029S831000, C029S832000, C029S847000, C029S852000, C174S255000

Reexamination Certificate

active

08033013

ABSTRACT:
The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.

REFERENCES:
patent: 4715928 (1987-12-01), Hamby
patent: 4869767 (1989-09-01), Robinson et al.
patent: 5499444 (1996-03-01), Doane et al.
patent: 6178093 (2001-01-01), Bhatt et al.
patent: 7281328 (2007-10-01), Lee et al.
patent: M259439 (2005-03-01), None

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