4. Electronic digital logic circuitry
  5. Interface
  6. Current driving

Chung-Tao Chang

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Built-in stress pattern on IC dies and method of forming

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Reexamination Certificate

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Contact type prober automatic alignment

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Contact type prober automatic alignment

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Method for forming solder bumps for flip-chip bonding by...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Optoelectronic transceiver having integrated optical and...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector
Reexamination Certificate

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Profile ID: LFUS-PAI-P-436004

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