4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant

Chung-Che Tsai

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Bonding pads of printed circuit board capable of holding...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Double-sided thermally enhanced IC chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means
Reexamination Certificate

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Fabrication method for circuit board

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Fabrication method of circuit board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Light sensitive semiconductor package and fabrication method...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2118314

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