Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-11-29
2005-11-29
Tugbang, A. Dexter (Department: 3762)
Metal working
Method of mechanical manufacture
Electrical device making
C029S846000, C029S831000, C029S842000, C029S855000, C029S840000, C029S843000, C216S013000, C216S017000, C216S018000, C216S038000, C216S040000, C216S041000, C216S049000
Reexamination Certificate
active
06968613
ABSTRACT:
A fabrication method of a circuit board is proposed, wherein a core layer is formed with a plurality of conductive traces, and photo resist is respectively applied on terminals of the conductive traces. Then, a non-solderable material is applied over the core layer as to cover the conductive traces except for the insulating material, and the non-solderable material is adapted to be surface-flush with the insulating material, allowing the insulating material to be exposed from the non-solderable material. Finally, the insulating material is removed from the core layer to expose the terminals of the conductive traces, wherein the exposed terminals are used as bond pads or bond fingers where solder balls, solder bumps or bonding wires can be bonded. This circuit board is cost-effectively fabricated by simplified processes, and beneficial in precisely exposing bond pads or bond fingers, thereby significantly improving yield of fabricated circuit boards.
REFERENCES:
patent: 4104111 (1978-08-01), Mack
patent: 4487654 (1984-12-01), Coppin
patent: 4720324 (1988-01-01), Hayward
patent: 4915983 (1990-04-01), Lake et al.
patent: 5227013 (1993-07-01), Kumar
patent: 5347712 (1994-09-01), Yasuda et al.
patent: 5487999 (1996-01-01), Farnworth
patent: 5511306 (1996-04-01), Denton et al.
patent: 5832598 (1998-11-01), Greenman et al.
patent: 6014805 (2000-01-01), Buixadera Ferrer
patent: 6233817 (2001-05-01), Ellis et al.
patent: 6389689 (2002-05-01), Heo
patent: 6432748 (2002-08-01), Hsu
patent: 6438830 (2002-08-01), Dibble et al.
patent: 6634100 (2003-10-01), Akram et al.
patent: 6651324 (2003-11-01), Pedretti et al.
Bai Jin-Chuan
Tsai Chung-Che
Corless Peter F.
Edwards & Angell LLP
Jensen Steven M.
Smith Terri Lynn
UltraTera Corporation
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