Bonding pads of printed circuit board capable of holding...

Details Bonding pads of printed circuit board capable of holding... Bonding pads of printed circuit board capable of holding...

2005-06-28

2005-06-28

Gibson, Randy W. (Department: 2841)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S261000, C174S050510, C361S767000

Reexamination Certificate

active

06911604

ABSTRACT:
A printed circuit board, which comprises a substrate, a conductive pattern disposed on a surface of said substrate and a solder mask coated on the surface of said substrate and covered over the conductive pattern. The conductive pattern has a bonding pad. The solder mask has an opening corresponding in location to the bonding pad such that a portion of the bonding pad is exposed outside. A space is left between said solder mask and said bonding pad and is communicated with the opening. Whereby, a solder ball can be received in the opening and the space and electrically connected to the bonding pad, such that the solder ball is held on the printed circuit board securely.

REFERENCES:
patent: 5889655 (1999-03-01), Barrow
patent: 6376279 (2002-04-01), Kwon et al.
patent: 6472608 (2002-10-01), Nakayama
patent: 6507082 (2003-01-01), Thomas
patent: 6700204 (2004-03-01), Huang et al.

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