4. Semiconductor device manufacturing: process
  5. Chemical etching
  6. Combined with coating step

Chun-Jen Huang

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Damascene interconnection structure and dual damascene...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Dual damascence process utilizing teos-based silicon oxide...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Dual damascence process utilizing teos-based silicon oxide...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for removing post-etch residue from wafer surface

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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Method of cleaning wafer after etching process

Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
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Profile ID: LFUS-PAI-P-2301563

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