Electronic assemblies having a low processing temperature

Details Electronic assemblies having a low processing temperature Electronic assemblies having a low processing temperature

2008-01-15

2008-01-15

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S122000

Reexamination Certificate

active

07319048

ABSTRACT:
Embodiments relate to electronic assemblies and methods for forming electronic assemblies. One method includes providing a die and a copper heat spreader that are to be coupled to one another through a thermal interface material. A layer of tin is formed on the copper heat spreader. The heat spreader and the die are clamped together with the tin positioned between the heat spreader and the die. The assembly is heated so that the tin melts and forms at least one intermetallic compound with copper from the heat spreader. The heat spreader is then coupled to the die through the intermetallic compound.

REFERENCES:
patent: 6833289 (2004-12-01), Hu et al.
patent: 7009289 (2006-03-01), Hu et al.
patent: 2003/0102526 (2003-06-01), Dias et al.
patent: 2004/0164402 (2004-08-01), Yoshimura
So et al., “High Temperature Joints Manufactured at Low Temperature,” 1998 Electronic Components and Technology Conference, 1998, pp. 284-291.

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