Electronic packages, assemblies, and systems with fluid cooling

Details Electronic packages, assemblies, and systems with fluid cooling Electronic packages, assemblies, and systems with fluid cooling

2006-10-24

2006-10-24

Chervinsky, Boris (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S689000, C361S698000, C361S700000, C257S714000, C257S715000, C165S080400, C174S015100

Reexamination Certificate

active

07126822

ABSTRACT:
To accommodate high power densities associated with high-performance integrated circuits, an integrated circuit (IC) package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to a heat spreader. The heat spreader has a fluid-conducting channel formed therein, and a fluid coolant may be circulated through the channel via a micropump. In an embodiment, the channel is located at or near a surface of the heat spreader, and a heat-generating IC is in thermal contact with the heat spreader. In an embodiment, the IC is a thinned die that is coupled to the heat spreader via a thinned thermal interface material. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

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