4. Refrigeration
  5. Using electrical or magnetic effect
  6. Thermoelectric; e.g., peltier effect

Chu-Chung Lee

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Ball grid array package having thermoelectric cooler

Refrigeration – Using electrical or magnetic effect – Thermoelectric; e.g. – peltier effect
Reexamination Certificate

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Cap layer for an aluminum copper bond pad

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Integrated circuit die having a copper contact and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Integrated circuit with test pad structure and method of...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Interconnect for chip level power distribution

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2020129

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