4. Electricity: electrical systems and devices
  5. Housing or mounting assemblies with diverse electrical...
  6. For electronic systems and devices

Christopher David Muzzy

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Chip underfill in flip-chip technologies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Current distribution structure and method

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
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Dual-sided chip attached modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
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Dual-sided chip attached modules

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Electrical interconnection structure formation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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Profile ID: LFUS-PAI-P-2181728

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