Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
2011-03-22
2011-03-22
Semenenko, Yuriy (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C174S261000
Reexamination Certificate
active
07911803
ABSTRACT:
An electrical structure and method of forming. The electrical structure comprises an interconnect structure and a substrate. The substrate comprises an electrically conductive pad and a plurality of wire traces electrically connected to the electrically conductive pad. The electrically conductive pad is electrically and mechanically connected to the interconnect structure. The plurality of wire traces comprises a first wire trace, a second wire trace, a third wire trace, and a fourth wire trace. The first wire trace and second wire trace are each electrically connected to a first side of the electrically conductive pad. The third wire trace is electrically connected to a second side of the electrically conductive pad. The fourth wire trace is electrically connected to a third side of said first electrically conductive pad. The plurality of wire traces are configured to distribute a current.
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Daubenspeck Timothy Harrison
Gambino Jeffrey Peter
Muzzy Christopher David
Sauter Wolfgang
International Business Machines - Corporation
Kotulak Richard M.
Schmeiser Olsen & Watts
Semenenko Yuriy
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