Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-05-16
2008-12-09
Parekh, Nitin (Department: 2811)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C436S108000, C436S109000, C257S723000, C257SE25012
Reexamination Certificate
active
07462509
ABSTRACT:
An method of packaging an electronic device. The method for packaging the device including: providing a first substrate, a second substrate and an integrated circuit chip having a first side and an opposite second side, a first set of chip pads on the first side and a second set of chip pads on the second side of the integrated circuit chip, chip pads of the first set of chip pads physically and electrically connected to corresponding substrate pads on the first substrate and chip pads of the second set of chip pads physically and electrically connected to substrate pads of the substrate.
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Bernstein Kerry
Dalton Timothy
Daubenspeck Timothy Harrison
Gambino Jeffrey Peter
Jaffe Mark David
International Business Machines - Corporation
Parekh Nitin
Sabo William D.
Schmeiser Olsen & Watts
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