4. Metal fusion bonding
  5. Process
  6. With protecting of work or filler or applying flux

Chris Rumer

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IC package pressure release apparatus and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Metallic solder thermal interface material layer and...

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Metallic solder thermal interface material layer and...

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Windowed package for electronic circuitry

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2424834

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