Metallic solder thermal interface material layer and...

Details Metallic solder thermal interface material layer and... Metallic solder thermal interface material layer and...

2008-03-25

2008-03-25

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C228S221000, C228S245000

Reexamination Certificate

active

10806118

ABSTRACT:
A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.

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