Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate
2008-03-25
2008-03-25
Stoner, Kiley (Department: 1725)
Metal fusion bonding
Process
With protecting of work or filler or applying flux
C228S221000, C228S245000
Reexamination Certificate
active
07347354
ABSTRACT:
A method of bonding a thermal interface layer to a heat dissipating member and the resulting device are described. The method may involve plating a bonding surface of the heat dissipating member, and bonding a metallic solder onto the plating under vacuum or inert conditions and substantially without the use of a solder flux. Also described, is a heat dissipating device having a thermal interface material layer bonded thereto for thermal coupling to a heat conducting component by an impermanent attachment.
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Christner Rod
Hurley Edward
Renfro Tim
Rumer Chris
Intel Corporation
KED & Associates LLP
Stoner Kiley
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