Windowed package for electronic circuitry

Details Windowed package for electronic circuitry Windowed package for electronic circuitry

2007-05-22

2007-05-22

Cao, Phat X. (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C438S126000

Reexamination Certificate

active

11171588

ABSTRACT:
An apparatus and method for releasing pressure existing within a package comprising a substrate to which a die is attached to provide electrical connections between the die and the exterior of the package, a lid, and sealant disposed between the substrate and the lid in a pattern with at least one break in the pattern.

REFERENCES:
patent: 4961106 (1990-10-01), Butt et al.
patent: 5081327 (1992-01-01), Graham et al.
patent: 5950074 (1999-09-01), Glenn et al.
patent: 6136128 (2000-10-01), Chung
patent: 6215180 (2001-04-01), Chen et al.
patent: 6232652 (2001-05-01), Matsushima
patent: 6410981 (2002-06-01), Tao
patent: 63029555 (1986-07-01), None
patent: 61256656 (1986-11-01), None
patent: 63084051 (1988-04-01), None
patent: 04083363 (1990-07-01), None
patent: 06140523 (1992-10-01), None
patent: 06232284 (1994-08-01), None
patent: 20000349178 (2000-12-01), None
Harper, Electronic Packaging and Interconnection Handbook, 1991, McGraw-Hill, pp. 1.9-10.
Merriam Webster's Collegiate Dictionary, Merriam Webster, 10th Edition, p. 1052.

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