4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Of specified configuration

Chris C. Chu

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Amorphous silicon sensor with micro-spring interconnects for...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Apparatus and method for miniature semiconductor packages

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
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Apparatus and method for miniature semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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Arrangement in semiconductor packages for inhibiting...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Bond pad structure comprising multiple bond pads with metal...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2124258

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