4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Choong Kooi Chee

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Capillary underfill and mold encapsulation method and apparatus

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
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Chip packaging compositions, packages and systems made...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
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Micro-electromechanical system (MEMS) polyelectrolyte gel...

Optical: systems and elements – Optical modulator – Having particular chemical composition or structure
Reexamination Certificate

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Micro-electromechanical system (mems) polyelectrolyte gel...

Optical: systems and elements – Optical modulator – Light wave temporal modulation
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Protected bond fingers

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Profile ID: LFUS-PAI-P-2403812

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