Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2007-08-28
2007-08-28
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21503
Reexamination Certificate
active
10675921
ABSTRACT:
A method of packaging a die includes attaching the die to a substrate; underfilling the space between the die and the substrate with a first material, and placing a second material in contact with at least a portion of the die and the substrate after underfilling the space between the die and substrate with the first material. A system includes a semiconductor package having a substrate, a die attached to the substrate, an underfill material positioned between the die and the substrate, and a molding material in contact with at least a portion of the substrate and the die. A heat sink is also in thermal contact with the semiconductor package.
REFERENCES:
patent: 6117797 (2000-09-01), Hembree
patent: 6248951 (2001-06-01), Murali et al.
patent: 6546620 (2003-04-01), Juskey et al.
patent: 6649446 (2003-11-01), Goetz et al.
patent: 2002/0008316 (2002-01-01), Miyazaki
patent: 2002/0089836 (2002-07-01), Ishida et al.
patent: 2003/0170450 (2003-09-01), Stewart et al.
patent: 2004/0056341 (2004-03-01), Endo et al.
patent: 2004/0121512 (2004-06-01), Manepalli et al.
patent: 2004/0159923 (2004-08-01), Skokov et al.
Chee Choong Kooi
Lai Yin Men
Low Mun Fai
Ng Cheong Huat
Then Edward
Geyer Scott B.
Intel Corporation
Schwegman Lundberg Woessner & Kluth P.A.
LandOfFree
Capillary underfill and mold encapsulation method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Capillary underfill and mold encapsulation method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Capillary underfill and mold encapsulation method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3881608