Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
Inventor
active
Board-on-chip type substrates with conductive traces in...
Interconnecting substrates for microelectronic dies, methods...
Metal core foldover package structures
Methods for designing carrier substrates with raised terminals
Methods of fabrication of lead frame-based semiconductor...
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Profile ID: LFUS-PAI-P-2271921