Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2011-03-29
2011-03-29
Pham, Hoai v (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S699000, C257S700000, C257SE23011, C438S106000
Reexamination Certificate
active
07915726
ABSTRACT:
Substrates for mounting microelectronic dies, methods for forming vias in such substrates, and methods for packaging microelectronic devices are disclosed herein. A method of manufacturing a substrate in accordance with one embodiment of the invention includes forming a conductive trace on a first side of a sheet of non-conductive material, and forming a via through the non-conductive material from a second side of the sheet to the conductive trace. The method further includes removing a section of the non-conductive material to form an edge of the non-conductive material extending across at least a portion of the via. In one embodiment, forming the edge across the via exposes at least a portion of the second conductive trace for subsequent attachment to a terminal on a microelectronic die.
REFERENCES:
patent: 5504035 (1996-04-01), Rostoker et al.
patent: 6011694 (2000-01-01), Hirakawa et al.
patent: 6043557 (2000-03-01), Phelps, Jr. et al.
patent: 6214641 (2001-04-01), Akram
patent: 6232551 (2001-05-01), Chang
patent: 6249052 (2001-06-01), Lin
patent: 6734534 (2004-05-01), Vu et al.
patent: 6841418 (2005-01-01), Jeung et al.
patent: 6903431 (2005-06-01), He
patent: 2002/0121688 (2002-09-01), Kinsman et al.
patent: 2003/0011075 (2003-01-01), Ohuchi et al.
patent: 2003/0116866 (2003-06-01), Cher 'Khng et al.
patent: 2003/0150641 (2003-08-01), Kinayman et al.
patent: 2003/0164303 (2003-09-01), Huang et al.
patent: 2004/0094833 (2004-05-01), Hasegawa et al.
patent: 2005/0112871 (2005-05-01), Ahn et al.
patent: 2005/0253284 (2005-11-01), Wang et al.
patent: 2007/0045834 (2007-03-01), Chong et al.
patent: 09153565 (1997-06-01), None
patent: 2002334951 (2002-11-01), None
patent: 2005136329 (2005-05-01), None
patent: 433632 (2001-05-01), None
patent: 480690 (2002-03-01), None
patent: 200507221 (2005-02-01), None
Search Report issued Apr. 7, 2010 in Taiwan Application No. 095131510.
Office Action (translation) issued Jan. 18, 2010 in Korea Application No. 10-2008-7007466.
Search Report and Written Opinion for Singapore Patent Application No. 200505618-9, mailed Dec. 11, 2006, 12 pages.
Search Report and Written Opinion for International Patent Application No. PCT/US2006/031280, mailed Feb. 2, 2007, 12 pages.
Chong Chin Hui
Corisis David J.
Lee Choon Kuan
Micro)n Technology, Inc.
Perkins Coie LLP
Pham Hoai v
Ullah Elias
LandOfFree
Interconnecting substrates for microelectronic dies, methods... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Interconnecting substrates for microelectronic dies, methods..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Interconnecting substrates for microelectronic dies, methods... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2684485