Metal core foldover package structures

Details Metal core foldover package structures Metal core foldover package structures

2006-08-28

2008-09-16

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23085, C257SE23135, C257SE23178, C257S777000, C257S723000, C257S778000, C257S673000, C257S773000, C257S774000, C257S680000, C257S730000, C257S731000, C257S732000, C257S729000, C257S786000, C257S784000, C257S690000, C257S693000, C257S698000

Reexamination Certificate

active

07425758

ABSTRACT:
Chip-scale packages and assemblies thereof and methods of fabricating such packages including Chip-On-Board, Board-On-Chip, and vertically stacked Package-On-Package modules are disclosed. The chip-scale package includes a core member of a metal or alloy having a recess for at least partially receiving a die therein and includes at least one flange member partially folded over another portion of the core member. Conductive traces extend from one side of the package over the at least one flange member to an opposing side of the package. Systems including the chip-scale packages and assemblies are also disclosed.

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