4. Semiconductor device manufacturing: process
  5. Formation of semiconductive active region on any substrate
  6. Fluid growth from liquid combined with preceding diverse...

Chipmos Technologies Inc.

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Film type package for fingerprint sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
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Flexible substrate for package of die

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
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Laser mark on an IC component

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – With textured surface
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Manufacturing process of semiconductor devices

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from liquid combined with preceding diverse...
Reexamination Certificate

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Method for manufacturing a semiconductor structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
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