Film type package for fingerprint sensor

Details Film type package for fingerprint sensor Film type package for fingerprint sensor

2007-04-27

2010-10-12

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Electromagnetic or particle radiation

C257SE33072

Reexamination Certificate

active

07812422

ABSTRACT:
A thin-film fingerprint sensor package primarily comprises a fingerprint sensor chip, a plurality of bumps, a wiring film, an encapsulant and a metal base to mechanically hold the fingerprint sensor chip. A sensing area is formed on the active surface of the fingerprint sensor chip. The bumps are disposed on the active surface. The wiring film has an opening to expose the sensing area and comprises a plurality of leads bonded to the bumps. The wiring film further has a ground lead electrically connecting the fingerprint sensor chip to the metal base. Therefore, the fingerprint sensor package can provide ESD protection during fingerprint recognition to avoid the damage of the fingerprint sensor chip.

REFERENCES:
patent: 6682981 (2004-01-01), Leedy
patent: 2003/0215117 (2003-11-01), Hata
patent: 2005/0259853 (2005-11-01), Miyai et al.
patent: 2006/0006487 (2006-01-01), Chen et al.
patent: 2006/0083411 (2006-04-01), Benkley
patent: 2006/0214294 (2006-09-01), Fukasawa
patent: 2007/0086634 (2007-04-01), Setlak et al.
patent: 2007/0246786 (2007-10-01), Melzak et al.
patent: 2008/0085038 (2008-04-01), Huang et al.
patent: 2008/0211048 (2008-09-01), Rolston et al.
patent: 2008/0309459 (2008-12-01), Bolis et al.
patent: 2009/0184408 (2009-07-01), Okada et al.
patent: I243437 (2005-11-01), None

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